| Identification | Back Directory | [Name]
BISPHENOL A ETHOXYLATE DIMETHACRYLATE | [CAS]
24448-20-2 | [Synonyms]
Bis-MEPP Bisphenol-A-ethoxylat(2)dimethacrylat BISPHENOL A ETHOXYLATE DIMETHACRYLATE ETHOXYLATED BISPHENOL A DIMETHACRYLATE ETHOXYLATED (6) BISPHENOL A DIMETHACRYLATE ETHOXYLATED (4) BISPHENOL A DIMETHACRYLATE ETHOXYLATED (10) BISPHENOL A DIMETHACRYLATE 2,2-bis-(4-(2-methacryloxyethoxy)phenyl)propane 2,2-BIS-[4-(METHACRYLOXYPOLYETHOXY)-PHENYL]-PROPANE Bisphenol A bis-(2-hydroxyethyl)-ether dimethacrylate Bisphenol A bis(2-hydroxyethyl) ether dimethylacrylate, stabilized Bismethacrylic acid isopropylidenebis(p-phenyleneoxyethylene) ester (1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl) bismethacrylate Bismethacrylic acid [(dimethylmethylene)bis(4,1-phenyleneoxyethylene)] ester Bismethacrylic acid [isopropylidenebis(4,1-phenylene)bisoxybisethylene] ester Bis(2-methylpropenoic acid)(1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl) ester 2-Propenoic acid, 2-methyl-, (1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl) ester 2-Propenoic acid,2-Methyl-, 1,1'-[(1-Methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl)]ester | [EINECS(EC#)]
246-263-7 | [Molecular Formula]
C27H32O6 | [MDL Number]
MFCD03703564 | [MOL File]
24448-20-2.mol | [Molecular Weight]
452.539 |
| Chemical Properties | Back Directory | [Melting point ]
44-45 °C | [Boiling point ]
574.6±50.0 °C(Predicted) | [density ]
1.12 g/mL at 25 °C(lit.)
| [refractive index ]
n20/D 1.532
| [Fp ]
>230 °F
| [InChI]
InChI=1S/C27H32O6/c1-19(2)25(28)32-17-15-30-23-11-7-21(8-12-23)27(5,6)22-9-13-24(14-10-22)31-16-18-33-26(29)20(3)4/h7-14H,1,3,15-18H2,2,4-6H3 | [InChIKey]
VIYWVRIBDZTTMH-UHFFFAOYSA-N | [SMILES]
C(C1=CC=C(OCCOC(=O)C(C)=C)C=C1)(C1=CC=C(OCCOC(=O)C(C)=C)C=C1)(C)C | [CAS DataBase Reference]
24448-20-2 | [EPA Substance Registry System]
Bisphenol A bis(2-hydroxyethyl ether) dimethacrylate (24448-20-2) |
| Hazard Information | Back Directory | [Uses]
2,2-bis(4-(2-Methacryloxyethoxy)-phenyl)propane is used in dental restorative composite materials; reactive monomer in adhesive products. |
|
|