导热硅胶垫片,BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000
  • 导热硅胶垫片,BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000
  • 导热硅胶垫片,BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000

BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000

价格 询价
包装 1SHEET
最小起订量 1000SHEET
发货地 广东
更新日期 2023-06-30

产品详情

中文名称:导热硅胶垫片英文名称:BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000
品牌: BERGQUIST产地: USA
产品类别: GAP PAD
型号: GPHC3.0外形尺寸: 203*406MM
2023-06-30 导热硅胶垫片 BERGQUIST GPHC3.0 GAP PAD HC 3.0 GAP PAD TGP HC3000 1SHEET/1RMB 1 BERGQUIST USA GAP PAD

    BERGQUIST  GPHC3.0 Features and Benefits

    • Thermal conductivity: 3.0 W/m-K

    • High-compliance, low

    compression stress

    • Fiberglass-reinforced for shear and tear

    resistance

BERGQUIST GPHC3.0,GAP PAD  HC 3.0,GAP PAD TGP HC3000 

BERGQUIST GAP PAD TGP HC3000 (thermal pad) is a soft and compliant gap filling material with a thermal conductivity 

of 3.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K 

filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiring

low stress on components and boards during assembly. BERGQUIST GPHC3.0(BERGQUIST thermal pad) maintains a conformable

nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness 

and/or topography.


BERGQUIST  GAP PAD HC 3.0 Typical Applications Include:

• Telecommunications

• ASICs and DSPs

• Consumer electronics

• Thermal modules to heat sinks

Configurations Available:

• Sheet form and die-cut parts

关键字: BERGQUIST GPHC3.0;GAP PAD TGP HC3000;GAP PAD HC 3.0;

公司简介

Shenzhen Hothree Technology Co., Ltd. was established in 2011. It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems. The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan. At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity. Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment. Company culture, Integrity and pragmatism, quick response, keep improving.
成立日期 2013-03-23 (13年) 注册资本 300万人民币
员工人数 1-10人 年营业额 ¥ 1000万-5000万
主营行业 聚合物材料,特种纤维及高功能材料,工业胶水 经营模式 贸易
  • 深圳市华思瑞科技有限公司
普通会员
  • 公司成立:13年
  • 注册资本:300万人民币
  • 企业类型:有限责任公司
  • 主营产品:美国BERGQUIST、日本DENKA等导热绝缘材料
  • 公司地址:Building F3, Jinyucheng Park, Longgang District
询盘

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