curing agent for epoxy resins

Molecular Formula: C₂H₄N₄     Molecular Weight:84.08

CAS No.:461-58-5

Properties:：
Micro-Dicyandiamide is free flowing White powder. 
Micro-Dicyandiamide is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clumping and improve application. Micro-dicyandiamide is designed for use as a latent agent for epoxy resins.
The fine particle size of Micro-dicyandiamide provides enhanced reactivity in epoxy resin.
Micro-dicyandiamide is easily dispersed in liquid resins.

Specification:

Usage:

1. Micro-dicyandiamide  can be used as One Component Adhesives

2. Micro-dicyandiamide  can be used as Epoxy Powder Coatings

3. Micro-dicyandiamide  can be used as  Prepregs and Film Adhesives

4.Micro-dicyandiamide can be used as  Electronic Potting and Encapsulating Compounds

Package and Storage: Net weight 25kg, 500kg, 1000kg poly woven bag, or other package